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Home » Ryan Knudtson is Recipient of the 2016 Richard C. Ryan Packaging Education Scholarship
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Ryan Knudtson is Recipient of the 2016 Richard C. Ryan Packaging Education Scholarship

February 2, 2017
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HARTLAND, Wis., (February 2, 2017) — Ryan Knudtson, a student at the University of Wisconsin - Stout, is the recipient of the 2016 Richard C. Ryan Packaging Education Scholarship, funded by Dorner Mfg. Corp.

This $2,000 scholarship, awarded to a student enrolled in a two- or four-year program at any of PMMI's partner schools, was established in honor of Richard Ryan, the former president and CEO of Dorner, who passed away suddenly in September 2012. Ryan was a member of the PMMI Board of Directors and encouraged lifelong learning. His commitment to education inspired the creation of this memorial scholarship.

"We are very impressed by the quality of applicants for the Richard C. Ryan Packaging Education Scholarship," said Terry Schadeberg, president and CEO, Dorner Manufacturing Corp. "We are pleased to have selected Ryan Knudtson as the 2016 recipient."

Kundtson is in his second year as a packaging major at UWS. He holds a bachelor's degree in education and taught three years before he made the courageous decision to go back to school to pursue a degree in packaging. He currently holds a 3.94 GPA and plans on completing a seven-month long internship at Johnsonville in Sheboygan, Wisconsin.

"I wholeheartedly endorse the aspirations of Ryan," said Brenda S. Puck, instructor, Engineering and Technology Department, University of Wisconsin - Stout. "His talents, intelligence and creativity will serve him well in the packaging engineering field. He will be an asset to any organization, bringing knowledge, leadership skills, caring, enthusiasm and professionalism to his colleagues."

In its fourth year, the scholarship is awarded to a student who presents merit in GPA, faculty recommendation and commitment to excellence within the packaging industry. Students applying for the scholarship must meet the following criteria:
• Have a GPA of 3.0 or higher
• Be enrolled in either a two- or four-year school and pursuing an undergraduate degree
• Be majoring in packaging engineering or a related area
• Demonstrate a commitment to excellence in the packaging area
• Be currently enrolled and attending a PMMI partnering school
• Demonstrate extra-curricular involvement, such as athletics
• Have a recommendation from faculty
• Have a financial need

Founded in 1933, PMMI, The Association for Packaging and Processing Technologies, is a trade association made up of more than 650 member companies that manufacturer packaging, processing and packaging-related converting machinery, commercially-available packaging machinery components, containers and materials in the United States, Canada and Mexico. PMMI's vision is to be the leading global resource for packaging and processing, and its mission is to improve and promote members' abilities to succeed in a global marketplace.

Connect with Dorner on Facebook at www.facebook.com/dornerconveyors
Follow Dorner on Twitter at www.twitter.com/dornerconveyors
Subscribe to Dorner on YouTube at https://www.youtube.com/user/DornerConveyors
Follow Dorner on LinkedIn at www.linkedin.com/company/dorner-mfg-corp
###
Hartland, Wisconsin-based Dorner Manufacturing is a world leader in the design, manufacture and distribution of high-quality conveyors and related equipment. Since 1966, companies from around the world have turned to Dorner conveyors for greatly improved efficiency and productivity. For more information about products or company news, visit Dorner's Web site at www.dornerconveyors.com or call 1-800-397-8664.

More Info: http://www.dornerconveyors.com

Submit your logistics, material handling, or supply chain related company news in DC VELOCITY's Industry Press Room section or New Products section
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