KSW Microtec AG unveils Thinlam, a contactless prelaminate for RFID card and government applications. Thinlam has a thickness down to 280um. It enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high-value features into cards. The exceptional thinness is achieved by manufacturing the Thinlam without chip modules?which also results in smoother card surfaces and a better printing outcome.
Thinlam maintains high durability thanks to its unique chip connection technology. In addition, due to the consistently reproducible antenna geometries, KSW Thinlam achieves tighter resonance frequency tolerances.
Company: KSW Microtec AG
Company URL: www.ksw-microtec.de