Hermetic Packaging Market is projected to reach USD 4.99 billion by 2025

Global Hermetic Packaging Market Analysis

According to Verified Market Research, The Global Hermetic Packaging Market was valued at USD 2.98 billion in 2017 and is projected to reach USD 4.99 billion by 2025, growing at a CAGR of 6.7% from 2018 to 2025.

What is Hermetic Packaging?

With rapid advancement in microelectronics, the need for air-tight packaging is booming in the semiconductor industry. Hermetic packaging is one such air tight seal which is made up of metals, ceramic materials and glass. Collectively it makes a hermetic packaging. It helps in preventing the moisture content get in touch with the materials. Hermetic packaging prevents the water vapor from accessing components that are present inside the package. It helps in keeping the package dry and moisture free for several years.

Global Hermetic Packaging Market Outlook

In the report, the market outlook section mainly encompasses fundamental dynamics of the market which include drivers, restraints, opportunities and challenges faced by the industry. Drivers and Restraints are intrinsic factors whereas opportunities and challenges are extrinsic factors of the market.

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The demands in consumer electronics market is increasing as retailers and manufacturers are more concerned about the safety of their product, hence, they are highly inclined towards hermetic packaging along with its growing popularity in various industries such as military & defense, aeronautics & space, automotive, medical, telecommunications and consumer electronics. Apart from this, other packaging methods are also available in the market which might hamper the growth of the global hermetic packaging market. Growing demand for energy and hermetically packaged products, especially the electronic components have contributed in the growth of hermetic packaging market.

Verified Market Research narrows down the available data using primary sources to validate the data and use it in compiling a full-fledged market research study. The report contains a quantitative and qualitative estimation of market elements which interests the client. The "Global Hermetic Packaging Market" is mainly bifurcated into sub-segments which can provide a classified data regarding latest trends in the market. This can be of a great use in gaining knowledge about the cutting-edge technologies in the market.

Global Hermetic Packaging Market Competitive Landscape
The "Global Hermetic Packaging Market" study report will provide a valuable insight with an emphasis on global market including some of the major players such as Texas Instruments, Schott AG, Ametek, Egide, Kyocera Corporation, Legacy Technologies and many more. Our market analysis also entails a section solely dedicated for such major players wherein our analysts provide an insight to the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above mentioned players globally.

Global Hermetic Packaging Market Segmentation, by Configuration
On the basis of configuration, Global Hermetic Packaging Market is segmented into:

Multilayer ceramic packages
Pressed ceramic packages
Metal can packages
The Multilayer Ceramic Packages Segment dominated the market in 2017 and is projected to grow at the highest CAGR over the forecast period.

Global Hermetic Packaging Market Segmentation, by Type
On the basis of type, Global Hermetic Packaging Market is classified into:

Ceramic-metal (CERTM) sealing
Reed glass
Transponder glass
Glass-metal sealing (GTMS)
Passivation glass
The Ceramic-Metal (CERTM) sealing segment dominated the market in the year 2017 and is expected to grow at a significant CAGR over the forecast period.

Global Hermetic Packaging Market Segmentation, by Application
On the basis of application, Global Hermetic Packaging Market is categorized into:

Transistors
Sensors
Lasers
Photodiodes
Airbag Igniters
Oscillating crystals
MEMS switches
Among the above applications, Transistors accounted for the largest market share of global hermetic packaging market followed by Sensors in the year 2017 and is expected to grow at a significant growth rate (CAGR) over the forecast period.

Global Hermetic Packaging Market Segmentation, by Industry
On the basis of industry, Global Hermetic Packaging Market is segmented into:

Military & defense
Aeronautics and space
Automotive
Medical
Telecommunications
Consumer electronics
Others
Military & Defense sector had the largest market share in the year 2017 and is expected to grow at the highest CAGR over the forecast period.

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Global Hermetic Packaging Market Geographic Scope
North America
U.S.
Canada
Mexico
Europe
Germany
UK
France
Rest of Europe
Asia Pacific
China
Japan
India
Rest of Asia Pacific
Latin America
Brazil
Rest of the World
Asia Pacific dominated the market in the year 2017. This region is expected to account for the largest share in the forthcoming years as it is the highest revenue contributor of the market.

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